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Flip chip
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#	Item
61	Microsoft Word - MEMS05_Fang.doc Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2004-10-27 21:09:24 Microtechnology Silicon Microelectromechanical systems Wafer Flip chip Hydrophobe Thermal oxidation Three-dimensional integrated circuit Properties of water Chemistry Semiconductor device fabrication Materials science
62	Volume 3, Issue 1 December 2003 www.solderingtech.com Soldering Technology Add to Reading List Source URL: www.solderingtech.com Language: English - Date: 2009-10-13 17:27:13 Electromagnetism Rework Solder Surface-mount technology Printed circuit board Flux Restriction of Hazardous Substances Directive Reflow soldering Flip chip Electronics manufacturing Electronics Technology
63	H. K. CHARLES jr. Miniaturized Electronics Harry K. Charles Jr. S Add to Reading List Source URL: www.jhuapl.edu Language: English - Date: 2006-09-15 16:02:52 Electronics manufacturing Semiconductor device fabrication Integrated circuits Electrical engineering Flip chip Multi-chip module Three-dimensional integrated circuit Ball grid array Chip scale package Electronics Electronic engineering Electromagnetism
64	Innovative Common Technologies to Support State-of-the-Art Products SMAFTI Package Technology Features Wide-Band and Large-Capacity Memory KURITA Yoichiro, SOEJIMA Koji, KAWANO Masaya Add to Reading List Source URL: www.nec.com Language: English - Date: 2013-10-01 21:40:28 Technology System in package Semiconductor device fabrication Ball grid array System on a chip Chip scale package Interposer Flip chip Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronics
65	Packaging Technology for Image-Processing LSI  Yoshiyuki Yoneda  Kouichi Nakamura Add to Reading List Source URL: www.fujitsu.com Language: English - Date: 2013-02-06 07:16:32 Semiconductor device fabrication Integrated circuits Semiconductor devices Electronic design Electronics manufacturing Flip chip Chip scale package Quad-flat no-leads package System in package Electronic engineering Electronics Technology
66	usmbcadpcomqueORIES512_WLCSP5967.svg Add to Reading List Source URL: datasheet.elcodis.com Language: English - Date: 2012-03-28 16:59:19 Computing Non-volatile memory Microcontrollers Digital electronics Computer buses Serial Peripheral Interface Bus EEPROM Flip-flop Chip select Computer hardware Computer memory Electronics
67	Endura® Ventura™ PVD First Metallization Solution for High-Volume Manufacturing of Through-Silicon Vias May 28, 2014 Add to Reading List Source URL: www.appliedmaterials.com Language: English - Date: 2014-05-28 07:48:48 Integrated circuits Technology Electronics manufacturing Three-dimensional integrated circuit Applied Materials Through-silicon via Flip chip Titanium nitride Via Electronics Electronic engineering Semiconductor device fabrication
68	MICROSYSTEM INTEGRATION AND PACKAGING Advanced Interconnect and Packaging Technologies RTI International is home to one of the premier wafer bumping and wafer-level packaging research and fabrication facilities in the U Add to Reading List Source URL: www.rti.org Language: English - Date: 2014-10-29 13:23:56 Materials science Flip chip Wafer-level packaging Chip scale package Microelectromechanical systems Solder RTI International Reliability Wafer Semiconductor device fabrication Electronics Technology
69	CMOSAIC RTD 2009 Intra chip stack fluidic cooling: the CMOSAIC demonstrator Add to Reading List Source URL: www.nano-tera.ch Language: English - Date: 2013-05-29 05:14:58 Integrated circuits Electronics manufacturing Electromagnetism Through-silicon via Flip chip Via Solder Three-dimensional integrated circuit Electronic engineering Electronics Semiconductor device fabrication
70	65th ECTC Call for Papers First Call For Papers IEEE 65th Electronic Components and Technology Conference www.ectc.net To be held May 26 - May 29, 2015 Add to Reading List Source URL: www.ectc.net Language: English - Date: 2014-07-17 15:59:18 Semiconductor device fabrication Semiconductors Electronic design Electronics manufacturing RF MEMS Wafer-level packaging Microelectromechanical systems Reliability Flip chip Technology Electronics Electromagnetism